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Global Climate Change Digest A Guide to Information on Greenhouse Gases and Ozone Depletion Published July 1988 through June 1999
FROM VOLUME 12, NUMBER 5, MAY 1999Computer-Chip Manufacturers to Cut PFCs
Item #d99may53
According to a May 6, 1999, EPA press release, the World Semiconductor
Council (WSC) has agreed to reduce emissions of perfluorocompounds (PFCs),
the most potent and persistent of all greenhouse gases, by at least 10%
below 1995 levels by 2010. PFCs are used for plasma etching thin films and
cleaning chemical vapor deposition tool chambers. Use of these chemicals
are critical to current semiconductor manufacturing methods and reducing
emissions is a formidable technical challenge. These chemicals have 10,000
times the global warming potential of carbon dioxide and have atmospheric
lifetimes ranging from 2,000 to 50,000 years. The WSC includes the
Semiconductor Industry Association of the United States, the European
Electronic Component Manufacturers Association, the Electronic Industries
Association of Japan, the Korea Semiconductor Industry Association, and
the Taiwan Semiconductor Industry Association. WSC members produce more
than 90% of the worlds semiconductors. The USEPA and the Japan
Ministry of International Trade and Industry actively supported and
encouraged the WSC agreement.
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